Laser-Induced Forward Transfer
(LIFT) Technology
  • Laser-based micro LED mass transfer technology
  • Individual chip selective transfer technology
  • High-speed, high-precision, and high-yield transfer technology
Full color(RGB) Micro LED
Interposer Technology
  • Interposer with a single integrated board of red, green, and blue micro LED
  • Application of micro LED
  • Various interposer sizes & pixels per inch
  • Two types such as Pad-up & Pad-down
Micro LED Bonding Technology
  • Micro LED bonding technology using ACF
  • Eutectic bonding technology applying Solder electrode